Ultrasonic transceiver with stacked die back cavity
OwnerRichard Przybyla, Benjamin Eric Eovino +1inventors
InventorsRichard Przybyla, Benjamin Eric Eovino, Stefon Eric Shelton
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Abstract
An ultrasonic transceiver includes a microelectromechanical system (MEMS) substrate having a micromachined ultrasonic transducer (MUT) suspended over a front cavity that is exposed to an external environment through an acoustic port. A semiconductor substrate includes a MEMS cap that is physically secured relative to the MEMS substrate, overlies the MUT, and defines a back cavity on an opposite side of the MUT from the front cavity, the back cavity enclosing an air volume.
Claims20
An ultrasonic transceiver, comprising:
- a microelectromechanical system (MEMS) substrate comprising a micromachined ultrasonic transducer (MUT) suspended over a front cavity in the MEMS substrate that is exposed to an external environment;
- and
- a semiconductor substrate comprising a cap that is physically secured relative to the MEMS substrate, overlying the MUT, and defining a back cavity that encloses an air volume and is located on an opposite side of the MUT from the front cavity.
A method of fabricating an ultrasonic transceiver, comprising:
- providing a microelectromechanical system (MEMS) substrate comprising a micromachined ultrasonic transducer (MUT) suspended over a front cavity in the MEMS substrate, the front cavity being configured to be exposed to an external environment;
- providing a semiconductor substrate comprising a cap defining a cavity recess;
- positioning the semiconductor substrate such that the semiconductor substrate overlies the MUT;
- and
- physically securing the semiconductor substrate relative to the MEMS substrate such that the cap cooperates with the MEMS substrate to define a back cavity that forms an air volume on an opposite side of the MUT from the front cavity.
Dependencies are inferred from the claim text.