H10W 72/322
Multilayered die-attach connectors
Official title: {Multilayered die-attach connectors, e.g. a coating on a top surface of a core}
H10W72/322 (Multilayered die-attach connectors) appears on 629 US grants and 845 published applications in this corpus.
Search patents in H10W- Granted patents
- 629
- Published applications
- 845
- Assignees
- 303
- Inventors
- 1,659
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 1 |
| 2002 | 4 | 6 |
| 2003 | 6 | 10 |
| 2004 | 8 | 2 |
| 2005 | 6 | 9 |
| 2006 | 2 | 9 |
| 2007 | 5 | 9 |
| 2008 | 3 | 11 |
| 2009 | 2 | 16 |
| 2010 | 10 | 20 |
| 2011 | 10 | 17 |
| 2012 | 17 | 38 |
| 2013 | 26 | 25 |
| 2014 | 26 | 45 |
| 2015 | 35 | 54 |
| 2016 | 32 | 57 |
| 2017 | 50 | 63 |
| 2018 | 38 | 39 |
| 2019 | 58 | 60 |
| 2020 | 64 | 68 |
| 2021 | 39 | 42 |
| 2022 | 38 | 60 |
| 2023 | 34 | 39 |
| 2024 | 47 | 47 |
| 2025 | 30 | 51 |
| 2026 | 14 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Integration and bonding of micro-devices into system substrate11 Aug 2026US 12,707,781 B2VueReal Inc.
- Semiconductor device and method for manufacturing the semiconductor device28 Jul 2026US 12,696,825 B2Denso Corporation
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Heat-dissipating semiconductor package with embedded heat-conducting member, method for manufacturing the same, and induction-heating soldering device used in manufacturing the same24 Sep 2026US 2026/0293670 A1Bs Technics Co., Ltd.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Semiconductor package and method for forming the same17 Sep 2026US 2026/0282906 A1STATS ChipPAC Management Pte. Ltd.
Most cited
By later US patents
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013
- Nickel tin bonding system with barrier layer for semiconductor wafers and devices198US 7,910,945 B2Cree, Inc. · 2011
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001