H10W 72/323
Characterised by the structures of the outermost layers
Official title: {characterised by the structures of the outermost layers, e.g. multilayered coatings}
H10W72/323 (Characterised by the structures of the outermost layers) appears on 46 US grants and 63 published applications in this corpus.
Search patents in H10W- Granted patents
- 46
- Published applications
- 63
- Assignees
- 33
- Inventors
- 118
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 3 | 2 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 1 | 2 |
| 2017 | 3 | 2 |
| 2018 | 0 | 2 |
| 2019 | 4 | 2 |
| 2020 | 1 | 3 |
| 2021 | 3 | 5 |
| 2022 | 5 | 13 |
| 2023 | 2 | 8 |
| 2024 | 12 | 6 |
| 2025 | 6 | 9 |
| 2026 | 3 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Method of forming confined growth S/D contact defined by sidewall constraints with selective deposition of inner spacer for CFET12 May 2026US 12,628,411 B2Tokyo Electron Limited
- Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices5 May 2026US 12,616,848 B2Immunolight, LLC
- Chemical bonding method and joined structure21 Oct 2025US 12,451,461 B2Canon Anelva Corporation
- Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined9 Sep 2025US 12,412,861 B2Mitsubishi Electric Corporation
- Semiconductor module manufacturing device and semiconductor module manufacturing method10 Sep 2026US 2026/0271765 A1Rohm Co., Ltd.
- Chip package with metal thermal interface material retainer14 May 2026US 2026/0136929 A1Advanced Micro Devices, Inc.
- Semiconductor device30 Apr 2026US 2026/0122993 A1Samsung Electronics Co., Ltd.
- Multilayer assembly, semiconductor device using same, and method for manufacturing same25 Dec 2025US 2025/0391743 A1Mitsubishi Materials Corporation
- Package structure and packaging method18 Dec 2025US 2025/0385211 A1Sureway Technology Co.,Ltd.
Most cited
By later US patents
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding16US 8,431,436 B1International Business Machines Corporation · 2013
- Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel10US 9,564,409 B2Semiconductor Components Industries, LLC · 2017
- Adhesive bonding composition and electronic components prepared from the same9US 10,283,476 B2Immunolight, LLC · 2019
- Solder preform and electronic component9US 7,800,230 B2Denso Corporation · 2010