Semiconductor package and method for forming the same

Abstract

A semiconductor package and a method for forming the same are provided. The method includes: providing a substrate; providing a semiconductor die stack including a first semiconductor die; mounting the semiconductor die stack on an upper surface of the substrate; forming a first barrier wall on the upper surface of the substrate, wherein the first barrier wall covers a lateral surface of the first semiconductor die and protrudes from an upper surface of the first semiconductor die; dispensing a first fluid material on the upper surface of the first semiconductor die, wherein the first barrier wall prevents the first fluid material from flowing across it; and curing the first fluid material to form a back side metallization (BSM) layer.

Dependencies are inferred from the claim text.