H10W 72/07237
Using a polymer adhesive
Official title: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
H10W72/07237 (Using a polymer adhesive) appears on 273 US grants and 320 published applications in this corpus.
Search patents in H10W- Granted patents
- 273
- Published applications
- 320
- Assignees
- 143
- Inventors
- 655
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 2 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 4 |
| 2006 | 2 | 3 |
| 2007 | 4 | 3 |
| 2008 | 2 | 3 |
| 2009 | 2 | 5 |
| 2010 | 1 | 3 |
| 2011 | 2 | 2 |
| 2012 | 3 | 17 |
| 2013 | 12 | 20 |
| 2014 | 15 | 17 |
| 2015 | 15 | 23 |
| 2016 | 17 | 24 |
| 2017 | 30 | 31 |
| 2018 | 19 | 23 |
| 2019 | 18 | 24 |
| 2020 | 23 | 24 |
| 2021 | 16 | 24 |
| 2022 | 28 | 24 |
| 2023 | 16 | 16 |
| 2024 | 19 | 13 |
| 2025 | 14 | 7 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for manufacturing semiconductor device, substrate, and semiconductor element18 Jun 2026US 2026/0173947 A1Resonac Corporation
- Chip packaging method and chip packaging structure7 May 2026US 2026/0130255 A1inSync Resonance Inc
- Semiconductor package and manufacturing method of the same26 Mar 2026US 2026/0090476 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Inductor on microelectronic die8 Jan 2026US 2026/0013151 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of forming electrically conductive polymer interconnects on electrical substrates159US 5,611,140 AEpoxy Technology, Inc. · 1997
- Use of nitrides for flip-chip encapsulation123US 5,956,605 AMicron Technology, Inc. · 1999
- Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument118US 6,812,549 B2Seiko Epson Corporation · 2004
- Integrated circuit chip using top post-passivation technology and bottom structure technology110US 8,456,856 B2Megica Corporation · 2013
- Current sensor88US 7,476,816 B2Allegro MicroSystems, LLC · 2009