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US 2026/0013151 A1Published application
Inductor on microelectronic die
AssigneeTexas Instruments Incorporated
InventorSreenivasan K Koduri
Life of this patent
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Abstract
A microelectronic device comprises: a die; a first metal column over a first bond pad of the die; a first metal strip over the die; a second metal column over the first metal strip; and a second metal strip over the first and second metal columns and over the die, in which the second metal strip has a pair of bent segments and a first segment coupled between the pair of bent segments.
Claims20
A microelectronic device, comprising:
- a die;
- a first metal column over a first bond pad of the die;
- a first metal strip over the die;
- a second metal column over the first metal strip;
- and
- a second metal strip over the first and second metal columns and over the die, in which the second metal strip has a pair of bent segments and a first segment coupled between the pair of bent segments.
3 more elements
A microelectronic device, comprising:
- a die;
- and
- an inductor coupled to the die, in which the inductor includes:
- a first metal pillar;
- a first metal strip, in which the first metal strip has a first pair of bent segments and a first segment coupled between the first pair of bent segments;
- a second metal pillar over one of the first pair of bent segments of the first metal strip;
- and
- a second metal strip having a second pair of bent segments and a second segment coupled between the second pair of bent segments, in which the second pair of bent segments are over the first and second metal pillars, and the first and second metal pillars support the second metal strip over the die.
5 more elements
Dependencies are inferred from the claim text.