H10W 70/662
Semiconductor materials
Official title: {Semiconductor materials}
H10W70/662 (Semiconductor materials) appears on 66 US grants and 77 published applications in this corpus.
Search patents in H10W- Granted patents
- 66
- Published applications
- 77
- Assignees
- 53
- Inventors
- 218
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 5 | 4 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 2 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 7 |
| 2015 | 3 | 3 |
| 2016 | 5 | 5 |
| 2017 | 9 | 4 |
| 2018 | 6 | 4 |
| 2019 | 2 | 7 |
| 2020 | 6 | 4 |
| 2021 | 5 | 4 |
| 2022 | 3 | 4 |
| 2023 | 2 | 3 |
| 2024 | 3 | 6 |
| 2025 | 1 | 8 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and equipment30 Jun 2026US 12,672,588 B2Canon Kabushiki Kaisha
- Electronic component with metallic cap21 Jan 2025US 12,205,857 B2Murata Manufacturing Co., Ltd.
- Semiconductor device for RF integrated circuit31 Dec 2024US 12,183,676 B2Monde Wireless Inc.
- Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices16 Jul 2024US 12,040,263 B2STMicroelectronics S,r.l.
- Packaged semiconductor device assembly20 Feb 2024US 11,908,784 B2NXP USA, Inc.
- Method for Forming an Interconnect Structure17 Sep 2026US 2026/0282941 A1
- Composite ic chips with common metallization layers over multiple chiplets6 Aug 2026US 2026/0231754 A1Intel Corporation
- Semiconductor device and equipment11 Jun 2026US 2026/0165210 A1Canon Kabushiki Kaisha
- Semiconductor package including interposer having glass core layer21 May 2026US 2026/0144093 A1Samsung Electronics Co., Ltd.
- Conductive materials with optical device structures for hybrid bonding19 Feb 2026US 2026/0053014 A1
Most cited
By later US patents
- Semiconductor crystallization on composite polymer substrates334US 6,236,061 B12001
- Conductively enclosed hybrid integrated circuit assembly using a silicon substrate77US 5,049,978 AGeneral Electric Company · 1991
- Coating for the structured production of conductors on the surface of electrically insulating substrates36US 5,955,179 ALpkf Laser & Electronics AG · 1999
- Electronic devices having metallurgies containing copper-semiconductor compounds31US 5,855,993 AInternational Business Machines Corporation · 1999
- Semiconductor device and method for the fabrication thereof30US 6,559,528 B2Matsushita Electric Industrial Co., Ltd. · 2003