Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices

A device, comprising:

• an electrically-insulating substrate having a first surface and a second surface opposite the first surface, wherein each of the first and second surfaces occupies a first square or rectangular area;
• at least one semiconductor die mounted at said first surface of the electrically-insulating said at least one respective semiconductor die mounting location;
• a plurality of electrically-conductive leads of a leadframe arranged around an opening defined by a second square or rectangular area that is larger than the first square or rectangular area, wherein said electrically-insulating substrate is positioned within the opening defined by the second square or rectangular area;
• a plurality of electrically-conductive formations coupling the at least one semiconductor die to selected leads in said plurality of electrically-conductive leads;
• and
• package molding material molded onto the at least one semiconductor die mounted at said first surface of the electrically-insulating substrate, onto the plurality of electrically-conductive leads of the leadframe and onto the plurality of electrically-conductive formations to form a flat, no-leads package leaving the second surface of said electrically-insulating substrate uncovered by said package molding material and leaving bottom surfaces of the plurality of electrically-conductive leads uncovered by said package molding material;
• wherein said plurality of electrically-conductive formations comprises a first electrically-conductive pattern on said first surface of the electrically-insulating substrate;
• a plurality of semiconductor dice mounted at said first surface of the electrically-insulating substrate at a respective plurality of semiconductor die mounting locations, wherein the first electrically-conductive pattern comprises electrically-conductive lines coupling at least one semiconductor die in said plurality of semiconductor dice to at least another semiconductor die in said plurality of semiconductor dice;
• wherein:
• said plurality of semiconductor dice comprises a first transistor die, a second transistor die, a first diode die, a second diode die, a first transistor driving circuit die and a second transistor driving circuit die;
• said plurality of electrically-conductive leads arranged around said substrate comprises a first set of control signal leads, a second set of control signal leads, a positive voltage supply lead, a negative or reference voltage supply lead and an output voltage lead;
• said electrically-conductive lines in said electrically-conductive pattern on said first surface of the electrically-insulating substrate comprise:
• a first electrically-conductive line coupling a drain or collector terminal of the first transistor die to a cathode terminal of the first diode die;
• a second electrically-conductive line coupling a drain or collector terminal of the second transistor die to a cathode terminal of the second diode die;
• a first subset of electrically-conductive lines configured to route signals from a periphery of the electrically-insulating substrate towards the first transistor driving circuit die;
• and
• a second subset of electrically-conductive lines configured to route signals from the periphery of the electrically-insulating substrate towards the second transistor driving circuit die;
• and
• wherein said plurality of electrically-conductive formations further comprises bonding wires coupling selected leads in said plurality of electrically-conductive leads to said electrically-conductive lines.