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US 2026/0053014 A1Published application
Conductive materials with optical device structures for hybrid bonding
OwnerGaius Gillman Fountain, Jr.inventor
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Abstract
A device comprises a first substrate directly hybrid bonded to a second substrate. The first substrate comprises at least one first conductive feature on at least one optical device material stack disposed in a first dielectric layer. The second substrate comprises at least one second conductive feature disposed in a second dielectric layer. A thickness of the at least one first conductive feature is less than about 300 nm, and a thickness of the at least one optical device material stack is greater than about 2 microns.
Claims21
A device comprising:
- a first substrate comprising at least one first conductive feature on at least one optical device material stack disposed in a first dielectric layer, wherein:
- a thickness of the at least one first conductive feature is less than about 300 nm;
- and
- a thickness of the at least one optical device material stack is greater than about 2 microns;
- and
- a second substrate directly hybrid bonded to the first substrate, the second substrate comprising at least one second conductive feature disposed in a second dielectric layer.
3 more elements
A method of bonding substrates comprising:
- providing a first substrate comprising at least one first conductive feature on at least one optical device material stack disposed in a first dielectric layer, wherein:
- a thickness of the at least one first conductive feature is less than about 300 nm;
- and
- a thickness of the at least one optical device material stack is greater than about 2 microns;
- providing a second substrate comprising at least one second conductive feature disposed in a second dielectric layer;
- and
- directly hybrid bonding the first substrate to the second substrate.
4 more elements
19-21. (canceled)
A device comprising:
- a reconstituted substrate comprising a plurality of LEDs disposed in a first dielectric layer on a silicon layer, each LED comprising an LED material stack and a first conductive feature on the LED material stack disposed in the first dielectric layer, wherein a thickness of the LED material stack is greater than about 2 microns, and a thickness of the first conductive features is less than about 300 nm;
- and
- a glass panel directly hybrid bonded to the reconstituted substrate, the glass panel comprising at least one second conductive feature disposed in a second dielectric layer.
Dependencies are inferred from the claim text.