Electronic component with metallic cap

A circuit board comprising:

• an electronic component comprising a package with a top side and a bottom side and
• at least one electronic chip housed within an enclosure inside the package,
• wherein the package comprises a package base on its top side, and the package base comprises a chip mounting element where at least one electronic chip is attached, and the package further comprises a metallic cap on its bottom side, wherein the at least one electronic chip is separated from the metallic cap by a gap and the metallic cap is attached to the package base to form said enclosure, and the metallic cap forms the bottom side of the package, wherein the metallic cap of the electronic component is attached to a surface of the circuit board, and the metallic cap comprises one or more first attachment regions and one or more second attachment regions, and
• wherein the surface of the circuit board comprises corresponding one or more first attachment regions and one or more second attachment regions which are aligned with the one or more first attachment regions and one or more second attachment regions, respectively, on the metallic cap, and the one or more first attachment regions on the metallic cap are attached to the one or more first attachment regions on the surface of the circuit board with a solder material, and the one or more second attachment regions on the metallic cap are attached to the one or more second attachment regions on the surface of the circuit board with a viscoelastic adhesive material.