H10W 70/66
Conductive materials thereof
H10W70/66 (Conductive materials thereof) appears on 2,687 US grants and 3,019 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,687
- Published applications
- 3,019
- Assignees
- 713
- Inventors
- 5,558
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 10 | 0 |
| 1988 | 7 | 0 |
| 1989 | 19 | 0 |
| 1990 | 18 | 0 |
| 1991 | 33 | 0 |
| 1992 | 28 | 0 |
| 1993 | 24 | 0 |
| 1994 | 33 | 0 |
| 1995 | 35 | 0 |
| 1996 | 25 | 0 |
| 1997 | 27 | 0 |
| 1998 | 42 | 0 |
| 1999 | 40 | 0 |
| 2000 | 50 | 0 |
| 2001 | 37 | 15 |
| 2002 | 34 | 46 |
| 2003 | 54 | 42 |
| 2004 | 33 | 31 |
| 2005 | 15 | 43 |
| 2006 | 32 | 34 |
| 2007 | 24 | 51 |
| 2008 | 24 | 29 |
| 2009 | 29 | 32 |
| 2010 | 31 | 48 |
| 2011 | 28 | 67 |
| 2012 | 39 | 85 |
| 2013 | 56 | 86 |
| 2014 | 83 | 128 |
| 2015 | 124 | 156 |
| 2016 | 147 | 193 |
| 2017 | 194 | 211 |
| 2018 | 177 | 169 |
| 2019 | 164 | 217 |
| 2020 | 180 | 189 |
| 2021 | 143 | 192 |
| 2022 | 169 | 190 |
| 2023 | 144 | 164 |
| 2024 | 122 | 180 |
| 2025 | 98 | 187 |
| 2026 | 91 | 234 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Semiconductor package comprising redistribution layer on wafer level chip scale package (WLCSP)6 Oct 2026US 12,757,805 B2Samsung Electronics Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
- Bonded body, ceramic circuit substrate, and semiconductor device1 Oct 2026US 2026/0305339 A1Niterra Materials Co., Ltd.
- Packages with plated die pads, terminals, and inductors1 Oct 2026US 2026/0305386 A1
- Substrate for semiconductor devices and method for manufacturing the same24 Sep 2026US 2026/0293698 A1Hyundai Mobis Co., Ltd.
- Polysic interposer with mandrel defined vias24 Sep 2026US 2026/0293734 A1Microchip Technology Incorporated
Most cited
By later US patents
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Stackable chip scale semiconductor package with mating contacts on opposed surfaces457US 6,013,948 AMicron Technology, Inc. · 2000
- Method of producing a single piece package for semiconductor die427US 5,674,785 AMicron Technology, Inc. · 1997
- Semiconductor crystallization on composite polymer substrates334US 6,236,061 B12001