H10W 70/664
Carbon-based materials
Official title: {Carbon-based materials, e.g. fullerenes}
H10W70/664 (Carbon-based materials) appears on 70 US grants and 94 published applications in this corpus.
Search patents in H10W- Granted patents
- 70
- Published applications
- 94
- Assignees
- 53
- Inventors
- 216
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 3 |
| 2006 | 3 | 5 |
| 2007 | 3 | 7 |
| 2008 | 3 | 4 |
| 2009 | 3 | 3 |
| 2010 | 3 | 2 |
| 2011 | 0 | 0 |
| 2012 | 2 | 3 |
| 2013 | 1 | 0 |
| 2014 | 3 | 1 |
| 2015 | 1 | 3 |
| 2016 | 1 | 5 |
| 2017 | 3 | 3 |
| 2018 | 5 | 4 |
| 2019 | 2 | 3 |
| 2020 | 3 | 7 |
| 2021 | 6 | 6 |
| 2022 | 7 | 9 |
| 2023 | 6 | 7 |
| 2024 | 6 | 8 |
| 2025 | 3 | 3 |
| 2026 | 4 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Semiconductor device and method of making redistribution layers with intensive pulsed light irradiation18 Aug 2026US 12,713,951 B2STATS ChipPAC Pte. Ltd.
- Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores24 Mar 2026US 12,588,572 B2STATS ChipPAC Pte. Ltd.
- Semiconductor device and method of making a semiconductor package with graphene-coated interconnects17 Mar 2026US 12,581,974 B2STATS ChipPAC Pte. Ltd.
- Semiconductor device and method of forming RDL with graphene-coated core30 Sep 2025US 12,431,422 B2STATS ChipPAC Pte. Ltd.
- Through glass via structures including an organic seed material layer for integrated circuit device packages18 Jun 2026US 2026/0173923 A1Intel Corporation
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects11 Jun 2026US 2026/0165167 A1STATS ChipPAC Pte. Ltd.
- Electronic device and manufacturing method thereof9 Apr 2026US 2026/0101778 A1Innolux Corporation
- Uniform seed layer for through holes in glass substrates19 Mar 2026US 2026/0082966 A1Intel Corporation
- Methods and systems for forming integrated circuit packages comprising glass layers1 Jan 2026US 2026/0005115 A1Intel Corporation
Most cited
By later US patents
- In-situ nano-interconnected circuit devices and method for making the same108US 6,297,063 B1Agere Systems Guardian Corp. · 2001
- Carbon nanotube-based conductive connections for integrated circuit devices43US 8,680,677 B2NXP B. V. · 2014
- Sensor component with a cavity housing and a sensor chip and method for producing the same18US 7,464,603 B2Infineon Technologies AG · 2008
- Functionalized boron nitride materials and methods for their preparation and use14US 9,859,034 B2Empire Technology Development LLC · 2018
- Nano-powder-based coating and ink compositions13US 7,736,693 B2Cima NanoTech Israel Ltd. · 2010