Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores

A semiconductor device, comprising:

• a substrate;
• an encapsulant deposited over a surface of the substrate with a via formed in the encapsulant;
• and
• a conductive material including a plurality of graphene core shells deposited in the via in the encapsulant to form a conductive post, wherein each of the graphene core shells is in contact with an adjacent graphene core shell to form a continuous path extending from a first surface of the conductive post to a second surface of the conductive post and the conductive material includes a plurality of cores covered by graphene and the graphene is formed as a mesh network over the cores and the graphene over the cores is in contact continuously between the first surface of the conductive post and the second surface of the conductive post to form the continuous path extending from the first surface of the conductive post to the second surface of the conductive post.

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing an electrical component over a first surface of the substrate;
• depositing a first encapsulant over the electrical component and first surface of the substrate;
• depositing a second encapsulant over a second surface of the substrate with a via formed in the second encapsulant;
• and
• depositing a conductive material including a plurality of graphene core shells in the via in the second encapsulant to form a conductive post, wherein the graphene core shells are each interconnected as one graphene core shell of the plurality of graphene core shells contacts another graphene core shell of the plurality of graphene core shells to form a continuous conduction path within the conductive post and the conductive material includes a plurality of cores covered by graphene and the graphene is formed as a mesh network over the cores and the graphene over the cores is in contact continuously between a first surface of the conductive post and a second surface of the conductive post to form the continuous path extending from the first surface of the conductive post to the second surface of the conductive post.

A method of making a semiconductor device, comprising:

• providing a substrate;
• depositing an encapsulant over a surface of the substrate with a via formed in the encapsulant;
• and
• depositing a conductive material including a plurality of graphene core shells in the via in the encapsulant to form a conductive post, wherein the graphene core shells are interconnected to form a continuous conduction path within the conductive post and the conductive material includes a plurality of cores covered by graphene and the graphene is formed as a mesh network over the cores and the graphene over the cores is in contact continuously between a first surface of the conductive post and a second surface of the conductive post to form the continuous path extending from the first surface of the conductive post to the second surface of the conductive post.