Carbon nanotube-based conductive connections for integrated circuit devices
AssigneeNXP B.V.
InventorChristopher Wyland
Life of this patent
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Abstract
Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with another material (130, 125) such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components.
Claims22
An integrated circuit arrangement comprising:
- an integrated circuit die;
- a conductor, including a carbon nanotube-based composite conductor, the conductor being configured and arranged for electrically connecting electrical components of the integrated circuit arrangement;
- and
- wherein the carbon nanotube-based composite conductor comprises a non-carbon nanotube material and a carbon nanotube material, the non-carbon nanotube material including an organic material configured to hold the carbon nanotube material.
An integrated circuit arrangement comprising:
- an integrated circuit die;
- and
- a conductor, including a carbon nanotube-based composite conductor, the conductor being configured and arranged for electrically connecting electrical components of the integrated circuit arrangement, wherein the carbon nanotube-based composite conductor includes a metal core with carbon nanotube material on an outer surface thereof.
An integrated circuit arrangement comprising:
- an integrated circuit substrate;
- an interconnect in the substrate, including a plurality of carbon nanotubes associated with a non-carbon nanotube material, the interconnect being configured and arranged for electrically connecting electrical components of the integrated circuit arrangement, the plurality of carbon nanotubes forming a carbon nanotube material;
- and
- a metal layer coated over the carbon nanotube material.
An integrated circuit arrangement comprising:
- an integrated circuit substrate;
- and
- an interconnect in the substrate, including a plurality of carbon nanotubes associated with a non-carbon nanotube material, the interconnect being configured and arranged for electrically connecting electrical components of the integrated circuit arrangement, wherein the integrated circuit substrate is a ball grid array (BGA) substrate and wherein the interconnect is arranged to electrically connect circuits in different portions of the BGA substrate and to electrically connect to a via in the BGA substrate.
An integrated circuit bondwire connector arrangement for connecting integrated circuit components, the bondwire connector arrangement comprising:
- a bondwire including a composite of metal and carbon nanotube-based material extending along a length of the bondwire, the bondwire being arranged for conducting electricity between integrated circuit components, and
- wherein the composite of metal and carbon nanotube-based material includes:
- a metal core extending the length of the bondwire;
- and
- a plurality of carbon nanotubes surrounding the metal core and extending the length of the bondwire.
An integrated circuit leadframe arrangement comprising:
- a leadframe including a combination of metal and carbon nanotube material,
- an integrated circuit die,
- an external circuit component,
- a metal layer coated over the carbon nanotube material, and
- wherein the leadframe is configured and arranged for electrically coupling the external circuit component to the integrated circuit die.
An integrated circuit leadframe arrangement comprising:
- a leadframe including a combination of metal and carbon nanotube material,
- an integrated circuit die,
- an external circuit component,
- wherein the leadframe is configured and arranged for electrically coupling the external circuit component to the integrated circuit die, and
- a metal layer coated over the carbon nanotube material, wherein the combination of metal and carbon nanotube material includes:
- a metal frame;
- and
- a plurality of carbon nanotubes coupled to an outer surface of the metal frame.
Dependencies are inferred from the claim text.