Electronic device and manufacturing method thereof

Abstract

Provided is an electronic device, which includes a substrate, a via, a conductive element and a circuit structure. The via penetrates through the substrate and includes a first via and a second via. The conductive element is disposed in the via and includes a first conductive element and a second conductive element. The first conductive element is disposed in the first via. The second conductive element is disposed in the second via. The circuit structure is disposed on the substrate and is electrically connected to the conductive element. In a first direction, there is a first spacing between the two adjacent first conductive elements. There is a second spacing between the two adjacent second conductive elements. The first spacing is greater than the second spacing.

Dependencies are inferred from the claim text.