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US 2026/0082966 A1Published application
Uniform seed layer for through holes in glass substrates
AssigneeIntel Corporation
InventorsLei JIN, Suresh Tanaji NARUTE, Ali LEHAF, Steve S. CHO, Jacob VEHONSKY, Srinivas Venkata Ramanuja PIETAMBARAM
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Abstract
Embodiments disclosed herein include an apparatus that comprises a substrate, and the substrate includes glass. In an embodiment, an opening is provided through a thickness of the substrate, and a layer is along a sidewall of the opening. In an embodiment, the layer comprises a polymer and an electrical conductor that comprises carbon. In an embodiment, a via is provided in the opening, and the via is an electrically conductive material.
Claims20
An apparatus, comprising:
- a substrate, wherein the substrate comprises glass;
- an opening through a thickness of the substrate;
- a layer along a sidewall of the opening, wherein the layer comprises a polymer and an electrical conductor that comprises carbon;
- and
- a via in the opening, wherein the via is an electrically conductive material.
2 more elements
An apparatus, comprising:
- a core, wherein the core comprises a glass layer;
- a via through a thickness of the core;
- a seed layer between the via and the core, wherein the seed layer comprises a colloid that comprises a polymer and an electrically conductive carbon-based material;
- and
- a first buildup layer over the core and a second buildup layer under the core, wherein the first buildup layer and the second buildup layer comprise an organic dielectric material.
2 more elements
An apparatus, comprising:
- a package substrate with a glass core between organic buildup layers;
- a via through the glass core;
- and
- a hybrid seed layer between the via and the glass core, wherein the hybrid seed layer comprises an organic polymer contacting the glass core and a layer comprising carbon over the organic polymer.
1 more element
Dependencies are inferred from the claim text.