POLYSiC INTERPOSER WITH MANDREL DEFINED VIAS
AssigneeMicrochip Technology Incorporated
InventorsSteve Nagel, Bomy Chen
Life of this patent
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Abstract
A method comprises shaping a silicon wafer to have a silicon base a silicon mandrel, forming a ceramic interposer over the silicon mandrel, removing the silicon mandrel from the ceramic interposer to form a through opening, and inserting via material in the through opening to form a via in the ceramic interposer. A ceramic interposer has a via extending from the front side to the back side of the ceramic interposer. A semiconductor package has a ceramic interposer made of a SiC powder heated and pressed into an amorphous poly-SiC ceramic with a via extending from the front side to the back side of the interposer, and a semiconductor chip on the front side of the ceramic interposer and connected to the via.
Claims20
A method comprising:
- providing a silicon wafer having a front side and a back side;
- shaping the silicon wafer to have a silicon base at the back side and a silicon mandrel having a proximal end at the silicon base and a distal end at the front side;
- forming a ceramic interposer comprising the silicon wafer having the silicon mandrel;
- removing the silicon mandrel from the ceramic interposer to form a through opening in the back side of the ceramic interposer;
- and
- inserting via material in the through opening to form a via in the ceramic interposer.
A device comprising:
- an interposer having a front side and a back side, wherein the interposer comprises a SiC powder heated and pressed into an amorphous poly-SiC ceramic;
- and
- a via extending from the front side to the back side of the interposer.
A system comprising:
- an interposer having a front side and a back side, wherein the interposer comprises a SiC powder heated and pressed into an amorphous poly-SiC ceramic;
- a via extending from the front side to the back side of the interposer;
- and
- a semiconductor chip on the front side of the ceramic interposer and connected to the via.
Dependencies are inferred from the claim text.