H10W 70/666
Organic materials or pastes
Official title: {Organic materials or pastes}
H10W70/666 (Organic materials or pastes) appears on 507 US grants and 301 published applications in this corpus.
Search patents in H10W- Granted patents
- 507
- Published applications
- 301
- Assignees
- 217
- Inventors
- 1,043
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 11 | 0 |
| 1992 | 8 | 0 |
| 1993 | 12 | 0 |
| 1994 | 17 | 0 |
| 1995 | 12 | 0 |
| 1996 | 16 | 0 |
| 1997 | 16 | 0 |
| 1998 | 22 | 0 |
| 1999 | 22 | 0 |
| 2000 | 36 | 0 |
| 2001 | 24 | 10 |
| 2002 | 24 | 35 |
| 2003 | 40 | 26 |
| 2004 | 20 | 21 |
| 2005 | 8 | 25 |
| 2006 | 21 | 12 |
| 2007 | 16 | 23 |
| 2008 | 9 | 7 |
| 2009 | 18 | 5 |
| 2010 | 12 | 12 |
| 2011 | 6 | 10 |
| 2012 | 7 | 8 |
| 2013 | 5 | 5 |
| 2014 | 4 | 12 |
| 2015 | 7 | 8 |
| 2016 | 14 | 6 |
| 2017 | 7 | 8 |
| 2018 | 7 | 9 |
| 2019 | 13 | 14 |
| 2020 | 9 | 3 |
| 2021 | 4 | 12 |
| 2022 | 10 | 13 |
| 2023 | 5 | 3 |
| 2024 | 5 | 3 |
| 2025 | 6 | 8 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Build up material architecture for microelectronic package device8 Sep 2026US 12,733,525 B2Intel Corporation
- Semiconductor device9 Sep 2025US 12,412,823 B2Renesas Electronics Corporation
- Electronic component9 Sep 2025US 12,412,828 B2Koa Corporation
- Lithographically defined electrical interconnects from conductive pastes12 Aug 2025US 12,388,004 B2Ormet Circuits, Inc.
- Through mold via frame20 May 2025US 12,308,307 B2Rockley Photonics Limited
- Polymer through glass via buffer layers in glass core substrates25 Jun 2026US 2026/0182404 A1Intel Corporation
- Through glass via structures including an organic seed material layer for integrated circuit device packages18 Jun 2026US 2026/0173923 A1Intel Corporation
- Heat dissipation structure for integrated circuit packages2 Apr 2026US 2026/0096426 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 3d stacking structure and method for fabricating the same20 Nov 2025US 2025/0357298 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Laser debond process for fabrication of high-density organic interposers28 Aug 2025US 2025/0273557 A1Intel Corporation
Most cited
By later US patents
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Stackable chip scale semiconductor package with mating contacts on opposed surfaces457US 6,013,948 AMicron Technology, Inc. · 2000
- Method of producing a single piece package for semiconductor die427US 5,674,785 AMicron Technology, Inc. · 1997
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002