Build up material architecture for microelectronic package device
AssigneeIntel Corporation
InventorsJieying Kong, Peumie Abeyratne Kuragama, Ala Omer, Ao Wang, Dilan Seneviratne
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Abstract
Microelectronic integrated circuit package structures include a first layer over a substrate, the first layer having a matrix material and a filler material within the matrix material. A second layer is on the first layer, the second layer comprising the matrix material or a second material, where the filler material is substantially absent from the second layer. A first portion of a conductive feature is on the second layer and a second portion of the conductive feature is on a sidewall of the first layer.
Claims15
An integrated circuit (IC) package structure, comprising:
- a first layer over a substrate, the first layer comprising a matrix material and a filler material within the matrix material;
- a second layer on the first layer, the second layer comprising the matrix material or a second material, wherein the filler material is substantially absent from the second layer;
- and
- a conductive feature, wherein a first portion of the conductive feature is directly on the second layer and a second portion of the conductive feature is directly on a sidewall of the first layer.
A microelectronic package structure, comprising:
- a first layer over a substrate, the first layer comprising a matrix material and a filler material within the matrix material;
- a second layer on the first layer, the second layer comprising the matrix material or a material different from the matrix material, wherein the second layer is substantially free of the filler material;
- a conductive feature, wherein a portion of the conductive feature is directly on the first layer;
- a die coupled to the conductive feature and on the first layer;
- and
- a power supply coupled to the die.
Dependencies are inferred from the claim text.