H10W 70/635
Through-vias
Official title: {Through-vias}
H10W70/635 (Through-vias) appears on 12,327 US grants and 15,183 published applications in this corpus.
Search patents in H10W- Granted patents
- 12,327
- Published applications
- 15,183
- Assignees
- 1,450
- Inventors
- 15,068
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 8 | 0 |
| 1985 | 8 | 0 |
| 1986 | 9 | 0 |
| 1987 | 8 | 0 |
| 1988 | 12 | 0 |
| 1989 | 22 | 0 |
| 1990 | 31 | 0 |
| 1991 | 33 | 0 |
| 1992 | 40 | 0 |
| 1993 | 45 | 0 |
| 1994 | 49 | 0 |
| 1995 | 45 | 0 |
| 1996 | 41 | 0 |
| 1997 | 66 | 0 |
| 1998 | 98 | 0 |
| 1999 | 99 | 0 |
| 2000 | 100 | 0 |
| 2001 | 120 | 69 |
| 2002 | 137 | 148 |
| 2003 | 136 | 133 |
| 2004 | 124 | 169 |
| 2005 | 109 | 206 |
| 2006 | 159 | 236 |
| 2007 | 121 | 201 |
| 2008 | 107 | 215 |
| 2009 | 128 | 232 |
| 2010 | 186 | 297 |
| 2011 | 212 | 371 |
| 2012 | 295 | 439 |
| 2013 | 356 | 562 |
| 2014 | 496 | 723 |
| 2015 | 637 | 803 |
| 2016 | 776 | 881 |
| 2017 | 852 | 865 |
| 2018 | 821 | 834 |
| 2019 | 845 | 1018 |
| 2020 | 857 | 1001 |
| 2021 | 750 | 948 |
| 2022 | 740 | 956 |
| 2023 | 773 | 957 |
| 2024 | 738 | 1092 |
| 2025 | 684 | 1100 |
| 2026 | 430 | 727 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Aligned via and trace formation using multi-tone phoitomasks and multi-layer photosensitive stacks6 Oct 2026US 12,757,748 B2Intel Corporation
- Semiconductor packages, semiconductor device and method for manufacturing a semiconductor package6 Oct 2026US 12,757,765 B2Seriphy Technology Corporation
- Circuit board and semiconductor package comprising same6 Oct 2026US 12,757,775 B2LG Innotek Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Semiconductor device structure and manufacturing method thereof8 Oct 2026US 2026/0314277 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic component and apparatus8 Oct 2026US 2026/0314402 A1
- Circuit board and semiconductor package substrate comprising same8 Oct 2026US 2026/0314444 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015