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US 12,757,775 B2Granted
Circuit board and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsHan Sang Kim, Bo Ra Kang, Jeong Han Kim
Life of this patent
Estimating the term…
Abstract
A circuit board according to an embodiment includes an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the insulating layer includes a surface layer containing fluorine (F), and the circuit pattern layer is disposed on the surface layer of the insulating layer.
Claims20
A circuit board comprising:
- an insulating layer including a through hole passing through an upper surface and a lower surface opposite to the upper surface;
- and
- a through electrode disposed in the through hole of the insulating layer,
- wherein the insulating layer includes a surface layer of a certain depth region along a horizontal direction from an inner wall of the through hole, and
- wherein the surface layer includes fluorine (F).
2 more elements
A semiconductor package comprising:
- an insulating layer including a through hole passing through an upper surface and a lower surface opposite to the upper surface;
- a circuit pattern layer disposed on the upper surface of the insulating layer;
- a through electrode disposed in the through hole of the insulating layer;
- and
- a semiconductor chip disposed on the circuit pattern layer,
- wherein the insulating layer includes a surface layer of a certain depth region along a horizontal direction from an inner wall of the through hole, and
- wherein the surface layer includes fluorine (F).
4 more elements
Dependencies are inferred from the claim text.