H10W 46/301
Marks applied to devices: for alignment
Official title: {for alignment}
H10W46/301 (Marks applied to devices: for alignment) appears on 2,853 US grants and 3,498 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,853
- Published applications
- 3,498
- Assignees
- 679
- Inventors
- 6,052
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 21 | 0 |
| 2000 | 31 | 0 |
| 2001 | 28 | 14 |
| 2002 | 34 | 32 |
| 2003 | 33 | 35 |
| 2004 | 39 | 34 |
| 2005 | 27 | 32 |
| 2006 | 24 | 28 |
| 2007 | 26 | 38 |
| 2008 | 16 | 54 |
| 2009 | 24 | 69 |
| 2010 | 44 | 67 |
| 2011 | 56 | 88 |
| 2012 | 70 | 96 |
| 2013 | 90 | 114 |
| 2014 | 101 | 109 |
| 2015 | 141 | 180 |
| 2016 | 151 | 164 |
| 2017 | 160 | 190 |
| 2018 | 176 | 189 |
| 2019 | 178 | 244 |
| 2020 | 205 | 242 |
| 2021 | 217 | 264 |
| 2022 | 200 | 250 |
| 2023 | 186 | 280 |
| 2024 | 206 | 278 |
| 2025 | 196 | 244 |
| 2026 | 126 | 163 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor device6 Oct 2026US 12,757,741 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of forming the same6 Oct 2026US 12,757,802 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method and device for the alignment of a substrate22 Sep 2026US 12,745,600 B2EV Group E. Thallner GmbH
- Lithography focus control method8 Oct 2026US 2026/0310070 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314430 A1SK hynix Inc.
- Assembly for sub-micron alignment and a method for sub-micron alignment using the assembly8 Oct 2026US 2026/0314431 A1National University of Singapore
- Sacrificial test structures for advanced packaging1 Oct 2026US 2026/0305265 A1International Business Machines Corporation
- Package with mold extension to enable package-to-package topside bridge attach1 Oct 2026US 2026/0305351 A1Intel Corporation
Most cited
By later US patents
- Vertical gate all around (VGAA) devices and methods of manufacturing the same987US 9,536,738 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices528US 6,762,076 B2Intel Corporation · 2004
- Process for manufacturing three dimensional IC's337US 5,266,511 AFujitsu Limited · 1993
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998