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AssigneesNational University of Singapore, POET Technologies Pte. Ltd.
InventorsChun Fei Siah, Yeow Kheng Lim, Simon Chun Kiat Goh, Yong Meng Lee, Suresh Venkatesan
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An assembly for sub-micron alignment is described. In an embodiment, the assembly for sub-micron alignment of a first semiconductor component with a second semiconductor component comprises a protrusion formed on a surface of the first semiconductor component and a cavity formed on a surface of the second semiconductor component adapted to receive the protrusion. Wherein in use, the first semiconductor component is placed in contact with the second semiconductor component via the protrusion to provide a first planar contact, and is subsequently displaced with respect to the second semiconductor component while maintaining the first planar contact to provide a second planar contact between the protrusion and a first cavity wall of the cavity for aligning the first semiconductor component with the second semiconductor component. Embodiments in relation to a method for sub-micron alignment using the assembly are also described.
An assembly for sub-micron alignment of a first semiconductor component with a second semiconductor component, the assembly comprising:
The assembly of any one of the preceding claims, wherein a volume of the protrusion is adapted to absorb mechanical energy resulted from contact impacts associated with the first and second planar contacts, and to plastically deform without fracturing.
The assembly of any one of the preceding claims, wherein the cavity is of a C-shaped or a L-shaped and is adapted to partially enclose the protrusion when in use.
The assembly of any one of the preceding claims, wherein the protrusion and the cavity form a protrusion-cavity pair, the assembly comprises two or more protrusion-cavity pairs.
The assembly of any one of the preceding claims, wherein the first planar contact and the second planar contact are orthogonal to each other.
The assembly of any one of the preceding claims, wherein the first planar contact is formed between the protrusion and a second cavity wall of the cavity.
The assembly of any one of the preceding claims, wherein in use, the first semiconductor component is displaced with respect to the second semiconductor component while maintaining the first planar contact and the second planar contact to provide a third planar contact between the protrusion and a third cavity wall of the cavity.
A method for sub-micron alignment of a first semiconductor component with a second semiconductor component using an assembly comprising a protrusion formed on a surface of the first semiconductor component and a cavity formed on a surface of the second semiconductor component adapted to receive the protrusion, the method comprising:
Dependencies are inferred from the claim text.