Package with mold extension to enable package-to-package topside bridge attach
AssigneeIntel Corporation
InventorsDebendra MALLIK, Rahul N. MANEPALLI, Sairam AGRAHARAM, Amruthavalli Pallavi ALUR, Ram S. VISWANATH
Life of this patent
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Abstract
Embodiments disclosed herein include an apparatus that includes a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a layer is on the first surface of the substrate, and a pillar is embedded in the layer. In an embodiment, a first pad is on a third surface of the layer that faces away from the substrate, where the first pad is coupled to the pillar. In an embodiment, a second pad is on the second surface of the substrate, where the first pad and the second pad share a substantially common centerline.
Claims20
An apparatus, comprising:
- a substrate with a first surface and a second surface opposite from the first surface;
- a layer on the first surface of the substrate;
- a pillar embedded in the layer;
- a first pad on a third surface of the layer that faces away from the substrate, wherein the first pad is coupled to the pillar;
- a second pad on the second surface of the substrate, wherein the first pad and the second pad share a substantially common centerline.
A method, comprising:
- forming a pillar on a first surface of a substrate;
- forming a mold layer over the first surface of the substrate, wherein the substrate embeds the first pillar;
- recessing the mold layer to expose the pillar;
- and
- forming a pad on a bottom surface of the mold layer, wherein the pad is aligned with a fiducial mark on a second surface of the substrate.
An apparatus, comprising:
- a first package substrate, wherein the first package substrate comprises:
- a first substrate;
- a first mold layer under the first substrate;
- a first pillar through the first mold layer;
- a first pad on the first mold layer;
- and
- a plurality of second pads on a first surface of the first substrate opposite from the first mold layer;
- a second package substrate, wherein the second package substrate comprises:
- a second substrate;
- a second mold layer under the second substrate;
- a second pillar through the second mold layer;
- a third pad on the second mold layer;
- and
- a plurality of fourth pads on a second surface of the second substrate opposite from the second mold layer;
- and
- a bridge coupled to the plurality of second pads and the plurality of fourth pads.
Dependencies are inferred from the claim text.