Back to results
US 2026/0305265 A1Published application
Sacrificial test structures for advanced packaging
AssigneeInternational Business Machines Corporation
InventorsUzma Rana, Reinaldo Vega, Takashi Ando, David Wolpert
Life of this patent
Estimating the term…
Abstract
Sacrificial test structures for testing with advanced packaging are provided. In one aspect, a device includes: a product structure having vias; and an etch-stop layer disposed on the product structure in between the vias, such that a surface of the etch-stop layer is coplanar with surfaces of the vias. A sacrificial test structure can be employed over the product structure, with the etch-stop layer therebetween. A method for using the present product structures is also provided.
Claims20
A device, comprising:
- a product structure having vias;
- and
- an etch-stop layer disposed on the product structure in between the vias, such that a surface of the etch-stop layer is coplanar with surfaces of the vias.
A device, comprising:
- a product structure having vias with recesses therein;
- and
- alignment mark shadows on at least one surface of the product structure outward from the vias;
- wherein the product structure comprises a chip or a wafer.
1 more element
A method, comprising:
- forming an etch-stop layer on a product structure, wherein the product structure has first vias, and wherein a top surface of the etch-stop layer is coplanar with top surfaces of the first vias;
- forming a sacrificial test structure on the product structure over the etch-stop layer, wherein the sacrificial test structure has second vias in direct contact with the first vias;
- testing the product structure through the sacrificial test structure using the second vias;
- and
- removing the sacrificial test structure along with any damage to it caused by the testing.
2 more elements
Dependencies are inferred from the claim text.