H10W 20/438
Interconnections with multiple fill metals
Official title: {Interconnections with multiple fill metals, e.g. having different metals in wide and narrow interconnections, or having different metals in vias and in trenches}
H10W20/438 (Interconnections with multiple fill metals) appears on 246 US grants and 325 published applications in this corpus.
Search patents in H10W- Granted patents
- 246
- Published applications
- 325
- Assignees
- 43
- Inventors
- 484
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 4 |
| 2005 | 0 | 0 |
| 2006 | 1 | 4 |
| 2007 | 2 | 3 |
| 2008 | 1 | 3 |
| 2009 | 3 | 1 |
| 2010 | 2 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 4 |
| 2014 | 2 | 4 |
| 2015 | 3 | 5 |
| 2016 | 8 | 8 |
| 2017 | 15 | 9 |
| 2018 | 7 | 15 |
| 2019 | 15 | 19 |
| 2020 | 19 | 18 |
| 2021 | 16 | 34 |
| 2022 | 27 | 67 |
| 2023 | 26 | 49 |
| 2024 | 29 | 33 |
| 2025 | 40 | 28 |
| 2026 | 18 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device including a self-formed barrier metal layer8 Oct 2026US 2026/0314351 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Surface Treatment For Selective Deposition13 Aug 2026US 2026/0234790 A1APPLIED Materials.Inc.
- Interconnection structure, and method for fabricating the same9 Jul 2026US 2026/0198299 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wiring structure with multiple conductive materials25 Jun 2026US 2026/0182339 A1Samsung Electronics Co., Ltd.
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Most cited
By later US patents
- Via hole profile and method of fabrication65US 5,470,790 AIntel Corporation · 1995
- Anchored via connection49US 5,619,071 AIntel Corporation · 1997
- Method for manufacturing fully aligned via structures having relaxed gapfills38US 10,177,028 B1Globalfoundries Inc. · 2019
- Borderless contact36US 6,083,824 ATaiwan Semiconductor Manufacturing Company.Ltd · 2000
- Method for forming interconnection of a semiconductor device32US 5,897,369 ALG Semicon Co., Ltd. · 1999