Wiring structure with multiple conductive materials

A wiring structure comprising:

• a first wiring on a substrate, the first wiring extending in a first direction parallel to an upper surface of the substrate, the first wiring having a first width in a second direction parallel to the upper surface of the substrate and crossing the first direction, and the first wiring including a first conductive material;
• a first via on and in contact with the first wiring, the first via having the first width in the second direction, wherein the first via includes a second conductive material different from the first conductive material;
• a second via on the first via, the second via having a second width in the second direction greater than the first via, wherein the second via comprises:
• a first conductive pattern including a third conductive material different from the first and second conductive materials, and
• a first barrier pattern covering a sidewall of the first conductive pattern, wherein the first barrier pattern includes a metal nitride;
• and
• a second wiring on the second via, the second wiring extending in the second direction, wherein the second wiring comprises:
• a second conductive pattern including the third conductive material;
• and
• a second barrier pattern covering a sidewall and at least a portion of a lower surface of the second conductive pattern, wherein the second barrier pattern is in contact with the first barrier pattern, and wherein the second barrier pattern includes the metal nitride.

A wiring structure comprising:

• a first wiring, a second wiring, and a third wiring at a same vertical level on a substrate, each of the first to third wirings extending in a first direction parallel to an upper surface of the substrate, the first to third wirings being spaced apart from each other in a second direction parallel to the upper surface of the substrate and crossing the first direction, wherein each of the first to third wirings includes a first conductive material;
• a first hard mask, a second hard mask, and a third hard mask on upper surfaces of the first wiring, the second wiring, and the third wiring, respectively, each of the first to third hard masks extending in the first direction;
• a first insulating interlayer pattern on the substrate, the first insulating interlayer pattern covering sidewalls of the first to third wirings and the first to third hard masks;
• a second insulating interlayer pattern on the first insulating interlayer pattern and the first to third hard masks;
• a first via including a second conductive material different from the first conductive material, wherein the first via comprises:
• a lower portion extending through the first hard mask, wherein the lower portion of the first via is in contact with the upper surface of the first wiring, and
• an upper portion on the lower portion of the first via, the upper portion of the first via extending through the second insulating interlayer pattern and in contact with an upper surface of the lower portion of the first via;
• a second via including the second conductive material, the second via extending through the second hard mask and in contact with the upper surface of the second wiring;
• a fourth wiring extending in the second direction on the first via and the first insulating interlayer pattern, the fourth wiring including a third conductive material different from the first and second conductive materials;
• a third via on the second via, the third via including the third conductive material;
• a fifth wiring extending in the second direction on the third via, the fifth wiring including the third conductive material;
• a fourth via including the third conductive material, the fourth via comprising:
• a lower portion extending through the third hard mask and in contact with the upper surface of the third wiring;
• and
• an upper portion on the lower portion of the fourth via, the upper portion of the fourth via extending through the second insulating interlayer pattern and in contact with an upper surface of the lower portion of the fourth via;
• and
• a sixth wiring on and in contact with the fourth via, the sixth wiring extending in the second direction, wherein the sixth wiring includes the third conductive material.