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US 5,619,071 AGranted
Anchored via connection
AssigneeIntel Corporation
InventorsAlan M. Myers, Peter K. Charvat, Thomas A. Letson, Shi-ning Yang, Peng Bai
Life of this patent
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Abstract
A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line.
Claims15
An interconnection structure for an integrated circuit comprising:
- a first conductive layer comprising a first metal;
- a second conductive layer on said first conductive layer, said second conductive layer comprising a second metal-first metal compound;
- and
- a via connection extending through said first conductive layer and into said second conductive layer, said via connection undercutting said first conductive layer.
1 more element
An interconnection structure for an integrated circuit formed on a semiconductor substrate comprising:
- a first conductive layer comprising aluminum above said substrate;
- a second conductive layer comprising a refractory metal-aluminum compound on said first conductive layer;
- an insulating layer above said second conductive layer;
- and
- a via connection said via connection having a first portion extending through said second conductive layer and a second portion extending into said first conductive layer, wherein said second portion of said via connection is wider than said first portion of said via connection.
2 more elements
Dependencies are inferred from the claim text.