H10W 20/421
Skip vias, i.e. vias that do not connect all metallization layers that
Official title: {Skip vias, i.e. vias that do not connect all metallization layers that they pass through}
H10W20/421 (Skip vias, i.e. vias that do not connect all metallization layers that) appears on 176 US grants and 217 published applications in this corpus.
Search patents in H10W- Granted patents
- 176
- Published applications
- 217
- Assignees
- 53
- Inventors
- 375
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 4 |
| 2013 | 0 | 0 |
| 2014 | 3 | 6 |
| 2015 | 3 | 5 |
| 2016 | 7 | 5 |
| 2017 | 9 | 6 |
| 2018 | 12 | 8 |
| 2019 | 13 | 14 |
| 2020 | 11 | 25 |
| 2021 | 23 | 26 |
| 2022 | 13 | 25 |
| 2023 | 16 | 33 |
| 2024 | 17 | 31 |
| 2025 | 27 | 14 |
| 2026 | 9 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Power plane between stacked fets9 Jul 2026US 2026/0198290 A1International Business Machines Corporation
- Tip to tip distance preservation at zero track skip18 Jun 2026US 2026/0173844 A1International Business Machines Corporation
- Forming zero-track skip super via11 Jun 2026US 2026/0165106 A1International Business Machines Corporation
- Word line drivers for multiple-die memory devices14 May 2026US 2026/0134904 A1Micron Technology, Inc.
- Semiconductor device19 Feb 2026US 2026/0053028 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- High density contact to relaxed geometry layers122US 7,474,000 B2SanDisk 3D LLC · 2009
- Method of making an integrated circuit which uses an etch stop for producing staggered interconnect lines79US 5,827,776 AAdvanced Micro Devices, Inc. · 1998
- Interconnection structure for conductive layers67US 5,408,130 AMotorola, Inc. · 1995
- Method for forming an interconnection structure for conductive layers66US 5,262,352 AMotorola, Inc. · 1993
- Integration of super via structure in BEOL34US 10,020,254 B1International Business Machines Corporation · 2018