Power plane between stacked fets
AssigneeInternational Business Machines Corporation
InventorsShay Reboh, Utkarsh Bajpai, James Patrick Mazza, Nicholas Anthony Lanzillo, Tenko Yamashita, Huiming Bu
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AssigneeInternational Business Machines Corporation
InventorsShay Reboh, Utkarsh Bajpai, James Patrick Mazza, Nicholas Anthony Lanzillo, Tenko Yamashita, Huiming Bu
Estimating the term…
Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a first stack of transistors in a first transistor cell, the first stack of transistors including a first top transistor and a first bottom transistor; a second stack of transistors in a second transistor cell, the second stack of transistors including a second top transistor and a second bottom transistor, the second transistor cell being adjacent to the first transistor cell; and at least one power plane between the first top transistor and the first bottom transistor and between the second top transistor and the second bottom transistor. A method of forming the same is also provided.
A semiconductor structure comprising:
A semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.