H10P 72/0468
Comprising a chamber adapted to a particular process
Official title: {comprising a chamber adapted to a particular process}
H10P72/0468 (Comprising a chamber adapted to a particular process) appears on 2,012 US grants and 2,717 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,012
- Published applications
- 2,717
- Assignees
- 431
- Inventors
- 5,033
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 15 | 0 |
| 1999 | 19 | 0 |
| 2000 | 23 | 0 |
| 2001 | 26 | 26 |
| 2002 | 42 | 62 |
| 2003 | 49 | 66 |
| 2004 | 42 | 85 |
| 2005 | 44 | 83 |
| 2006 | 40 | 95 |
| 2007 | 51 | 124 |
| 2008 | 35 | 139 |
| 2009 | 43 | 116 |
| 2010 | 70 | 80 |
| 2011 | 87 | 99 |
| 2012 | 78 | 99 |
| 2013 | 68 | 58 |
| 2014 | 71 | 105 |
| 2015 | 86 | 115 |
| 2016 | 97 | 93 |
| 2017 | 73 | 105 |
| 2018 | 75 | 135 |
| 2019 | 103 | 130 |
| 2020 | 110 | 156 |
| 2021 | 118 | 133 |
| 2022 | 94 | 160 |
| 2023 | 105 | 155 |
| 2024 | 114 | 133 |
| 2025 | 94 | 108 |
| 2026 | 77 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Storage and transfer module and substrate treatment apparatus including storage and transfer module29 Sep 2026US 12,748,355 B2Semes Co., Ltd.
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- Apparatus of cleaning substrate, apparatus of semiconductor device and method for manufacturing a semiconductor package using the same8 Sep 2026US 12,733,427 B2Samsung Electronics Co., Ltd.
- Methods for forming mandrels and spacers, related structures, and systems1 Sep 2026US 12,727,444 B2ASM IP Holding B. V.
- Split double sided wafer and reticle clamps25 Aug 2026US 12,717,249 B2ASML Holding N. V.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314316 A1SCREEN Holdings Co., Ltd.
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method1 Oct 2026US 2026/0305239 A1SCREEN Holdings Co., Ltd.
- Multiple-chamber semiconductor serial constructing apparatus24 Sep 2026US 2026/0293583 A1Advanced Ion Beam Technology, Inc.
- Controlling method for semiconductor process auxiliary apparatus, control assembly and manufacturing system17 Sep 2026US 2026/0282812 A1United Microelectronics Corp.
Most cited
By later US patents
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Sequential precursor dosing in an ALD multi-station/batch reactor542US 8,940,646 B1Lam Research Corporation · 2015
- Methods for atomic layer etching526US 8,633,115 B2APPLIED Materials.Inc. · 2014
- Method for forming SiOCH film using organoaminosilane annealing525US 9,190,263 B2ASM IP Holding B. V. · 2015