H10P 72/0474
Comprising at least one lithography chamber
Official title: {comprising at least one lithography chamber}
H10P72/0474 (Comprising at least one lithography chamber) appears on 356 US grants and 484 published applications in this corpus.
Search patents in H10P- Granted patents
- 356
- Published applications
- 484
- Assignees
- 99
- Inventors
- 986
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 2 |
| 2002 | 11 | 9 |
| 2003 | 5 | 11 |
| 2004 | 9 | 9 |
| 2005 | 5 | 15 |
| 2006 | 5 | 25 |
| 2007 | 8 | 37 |
| 2008 | 9 | 38 |
| 2009 | 11 | 29 |
| 2010 | 27 | 14 |
| 2011 | 22 | 17 |
| 2012 | 12 | 18 |
| 2013 | 13 | 10 |
| 2014 | 14 | 8 |
| 2015 | 12 | 11 |
| 2016 | 10 | 13 |
| 2017 | 9 | 12 |
| 2018 | 10 | 16 |
| 2019 | 18 | 17 |
| 2020 | 12 | 22 |
| 2021 | 21 | 21 |
| 2022 | 13 | 26 |
| 2023 | 15 | 35 |
| 2024 | 25 | 39 |
| 2025 | 20 | 22 |
| 2026 | 20 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Storage and transfer module and substrate treatment apparatus including storage and transfer module29 Sep 2026US 12,748,355 B2Semes Co., Ltd.
- Split double sided wafer and reticle clamps25 Aug 2026US 12,717,249 B2ASML Holding N. V.
- Coating and developing device7 Jul 2026US 12,675,054 B2ACM Research Korea CO., LTD.
- Developing apparatus30 Jun 2026US 12,672,503 B2Tokyo Electron Limited
- System and method for optimizing through silicon via overlay2 Jun 2026US 12,645,152 B2KLA Corporation
- Feed-forward device fabrication17 Sep 2026US 2026/0282844 A1Google Inc.
- Substrate transfer method, substrate processing apparatus, and program13 Aug 2026US 2026/0235967 A1Tokyo Electron Limited
- Method of treating substrate including identifying condition of substrate13 Aug 2026US 2026/0237612 A1Semes Co., Ltd.
- Apparatus for processing substrate2 Jul 2026US 2026/0190919 A1Semes Co., Ltd.
- Bond protection for an electrostatic chuck in a plasma processing chamber18 Jun 2026US 2026/0171368 A1Lam Research Corporation
Most cited
By later US patents
- Semiconductor production system202US 6,591,207 B2Hitachi, Ltd. · 2003
- Semiconductor production system201US 6,850,854 B2Hitachi, Ltd. · 2005
- Substrate processing apparatus and method132US 7,867,926 B2Tokyo Electron Limited · 2011
- Semiconductor device and manufacturing method thereof123US 6,387,737 B1Semiconductor Energy Laboratory Co.Ltd. · 2002
- S system for the formation of a silicon thin film and a semiconductor-insulating film interface88US 6,861,614 B1Anelva Corporation · 2005