Substrate processing apparatus and method

A substrate processing apparatus for radiating UV rays (ultraviolet rays) onto a target film formed on a target surface of a substrate to perform a curing process of the target film, the substrate processing apparatus comprising:

• a hot plate that heats the substrate to a predetermined temperature;
• a plurality of support pins disposed on the hot plate to support the substrate;
• a UV radiating device that radiates UV rays onto the target surface of the substrate supported on the support pins;
• and
• a cooling device that cools the hot plate to increase the thermal capacity of the hot plate, the cooling device comprising a base plate structurally connected to the hot plate through struts and provided with a cooler built therein, wherein
• the support pins are preset to provide a predetermined thermal conductivity to conduct heat of the substrate to the hot plate,
• the hot plate is preset to have a predetermined thermal capacity sufficient to absorb heat conducted through the support pins, and
• the cooling device is disposed to face, with a gap therebetween, a surface of the hot plate opposite to a surface provided with the support pins.

A substrate processing method for radiating UV rays (ultraviolet rays) onto a target film formed on a target surface of a substrate to perform a curing process of the target film, the substrate processing method comprising:

• placing the substrate on a plurality of support pins disposed on a hot plate;
• then, heating the substrate to a predetermined temperature by the hot plate;
• and
• then, radiating UV rays onto the target surface of the substrate supported on the support pins, thereby performing the curing process, wherein
• the support pins are arranged such that an area of the hot plate with a higher illumination intensity of UV rays from the UV radiating device is provided with a larger number of support pins,
• the support pins are preset to provide a predetermined thermal conductivity, and the hot plate is preset to have a predetermined thermal capacity, and
• the curing process comprises conducting heat, applied to the substrate by the UV rays, through the support pins to the hot plate, and absorbing the heat conducted through the support pins into the hot plate, thereby preventing the substrate from being overheated.

A substrate processing method for radiating UV rays (ultraviolet rays) onto a target film formed on a target surface of a substrate to perform a curing process of the target film, the substrate processing method comprising:

• placing the substrate on a plurality of support pins disposed on a hot plate;
• then, heating the substrate to a predetermined temperature by the hot plate;
• then, radiating UV rays onto the target surface of the substrate supported on the support pins, thereby performing the curing process;
• and
• cooling the hot plate by a cooling device to increase the thermal capacity of the hot plate, wherein
• the curing process comprises conducting heat, applied to the substrate by the UV rays, through the support pins to the hot plate, and absorbing the heat conducted through the support pins into the hot plate, thereby preventing the substrate from being overheated,
• the support pins are preset to provide a predetermined thermal conductivity, and the hot plate is preset to have a predetermined thermal capacity,
• the cooling device is disposed to face, with a gap therebetween, a surface of the hot plate opposite to a surface provided with the support pins, and
• the cooling device comprises a base plate structurally connected to the hot plate through struts and is provided with a cooler built therein.