H10P 72/0472
Comprising at least one polishing chamber
Official title: {comprising at least one polishing chamber}
H10P72/0472 (Comprising at least one polishing chamber) appears on 325 US grants and 451 published applications in this corpus.
Search patents in H10P- Granted patents
- 325
- Published applications
- 451
- Assignees
- 75
- Inventors
- 825
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 16 |
| 2002 | 18 | 14 |
| 2003 | 13 | 19 |
| 2004 | 10 | 22 |
| 2005 | 14 | 10 |
| 2006 | 11 | 14 |
| 2007 | 13 | 14 |
| 2008 | 3 | 13 |
| 2009 | 2 | 15 |
| 2010 | 9 | 6 |
| 2011 | 9 | 4 |
| 2012 | 8 | 7 |
| 2013 | 1 | 4 |
| 2014 | 4 | 15 |
| 2015 | 4 | 12 |
| 2016 | 11 | 12 |
| 2017 | 8 | 22 |
| 2018 | 9 | 20 |
| 2019 | 15 | 24 |
| 2020 | 20 | 31 |
| 2021 | 21 | 34 |
| 2022 | 18 | 28 |
| 2023 | 22 | 26 |
| 2024 | 24 | 36 |
| 2025 | 30 | 20 |
| 2026 | 13 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- System and method for cleaning a wafer surface18 Aug 2026US 12,713,876 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding apparatus and bonding method11 Aug 2026US 12,707,919 B2Tokyo Electron Limited
- Substrate processing apparatus4 Aug 2026US 12,701,947 B2Ebara Corporation
- Semiconductor processing tool and methods of operation19 May 2026US 12,635,440 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Cmp device and wafer transfer method3 Sep 2026US 2026/0262468 A1Hangzhou Sizone Electronic Technology Inc.
- High throughput polishing modules and modular polishing systems27 Aug 2026US 2026/0255918 A1APPLIED Materials.Inc.
- Chemical mechanical polishing device and method for processing wafer using same6 Aug 2026US 2026/0231722 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus16 Jul 2026US 2026/0200034 A1Ebara Corporation
- Wafer processing apparatus11 Jun 2026US 2026/0165071 A1Meere Company Inc.
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Precision polishing apparatus with detecting means78US 6,012,966 ACanon Kabushiki Kaisha · 2000
- Polishing apparatus77US 5,616,063 AEbara Corporation · 1997
- Integrated electrodeposition and chemical-mechanical polishing tool60US 6,110,011 AAPPLIED Materials.Inc. · 2000
- Polishing aparatus and method59US 5,679,059 AEbara Corporation · 1997