Wafer processing apparatus
AssigneeMeere Company Inc.
InventorYoung Hui BAK
Life of this patent
Estimating the term…
Abstract
Provided is a wafer processing apparatus, including a turn table which rotates around a center axis and is positioned in alignment with a grinding area for grinding a wafer and a polishing area for polishing a wafer, a plurality of chuck tables arranged on the turn table and configured to seat the wafers, a grinding member for grinding the wafer positioned in the grinding area, a polishing member for polishing the wafer ground by the grinding member, a frame separating the grinding area and the polishing area from each other on the turn table, and a moisture removal unit arranged on the frame and for removing moisture from the wafer which moves from the grinding area to the polishing area by rotation of the turn table.
Claims13
A wafer processing apparatus, comprising:
- a turn table which rotates around a center axis and is positioned in alignment with a grinding area for grinding a wafer and a polishing area for polishing a wafer;
- a plurality of chuck tables arranged on the turn table and configured to seat the wafers;
- a grinding member for grinding the wafer positioned in the grinding area;
- a polishing member for polishing the wafer ground by the grinding member;
- a frame separating the grinding area and the polishing area from each other on the turn table;
- and
- a moisture removal unit arranged on the frame and removing moisture from the wafer moving from the grinding area to the polishing area by rotation of the turn table.
A wafer processing apparatus, comprising:
- a turn table which rotates around a center axis and is positioned in alignment with a grinding area for grinding a wafer and in a polishing area for polishing a wafer;
- a plurality of chuck tables arranged on the turn table and configured to seat the wafers;
- a grinding member for grinding the wafer positioned in the grinding area;
- a polishing member for polishing the wafer ground by the grinding member;
- and
- a frame separating the grinding area and the polishing area from each other on the turn table, wherein
- the polishing area includes a swing nozzle arranged between the chuck tables and the polishing member in the polishing area and spraying gas toward the wafer and
- a swing nozzle cover extending from the swing nozzle to cover in between the chuck table and a polishing wheel.
Dependencies are inferred from the claim text.