Precision polishing apparatus with detecting means
AssigneeCanon Kabushiki Kaisha
InventorsMikichi Ban, Matsuomi Nishimura, Kazuo Takahashi
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Abstract
In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out as products out of an unloading unit. The defective articles are classified in a discriminating device in conformity with the kinds of the defects thereof, and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.
Claims59
A precision polishing apparatus comprising a polishing unit having polishing means for polishing a workpiece, a removing unit for removing a stain on a polished surface of the workpiece transported from said polishing unit, detecting means for detecting a state of the polished surface of the workpiece operated upon by said removing unit, and selectively returning means for selectively returning the workpiece to said polishing unit or said removing unit in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a polishing unit having polishing means for polishing a workpiece, a removing unit for removing a stain on a polished surface of the workpiece transported from said polishing unit, a drying unit for drying the workpiece transported from said removing unit, detecting means for detecting a state of the polished surface of the workpiece dried by said drying unit, and selectively returning means for selectively returning the workpiece to said polishing unit or said removing unit in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a first unit to load and to stock a workpiece, a second unit provided with polishing means for polishing the workpiece transported from said first unit, a third unit for removing a stain on a polished surface of the workpiece transported from said second unit, a fourth unit for drying the workpiece transported from said third unit, detecting means for detecting a state of the polished surface of the workpiece transported from said fourth unit, and selectively returning means for selectively returning said workpiece to one of said first to fourth units in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a polishing unit having polishing means for polishing a workpiece, a removing unit for removing a stain on a polished surface of the workpiece transported from said polishing unit, detecting means for detecting a defect of the polished surface of the workpiece operated upon by said removing unit, and selectively returning means for selectively returning the workpiece to said polishing unit or said removing unit in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a polishing unit having polishing means for polishing a workpiece, a removing unit for removing a stain on a polished surface of the workpiece transported from said polishing unit, a drying unit for drying the workpiece transported from said removing unit, detecting means for detecting a defect of the polished surface of the workpiece dried by said drying unit, and selectively returning means for selectively returning the workpiece to said polishing unit or said removing unit in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a first unit to load and to stock a workpiece, a second unit provided with polishing means for polishing the workpiece transported from said first unit, a third unit for removing a stain on a polished surface of the workpiece transported from said second unit, a fourth unit for drying the workpiece transported from said third unit, detecting means for detecting a defect of the polished surface of the workpiece transported from said fourth unit, and selectively returning means for selectively returning said workpiece to one of said first to fourth units in conformity with the result of the detection by said detecting means.
A precision polishing apparatus comprising a polishing unit having polishing means for polishing a workpiece, a removing unit for removing a stain on a polished surface of the workpiece transported from the polishing unit, detecting means for detecting a state of the polished surface of the workpiece operated upon by the removing unit, and a returning means for returning the workpiece to the removing unit in conformity with the result of the detection by the detecting means.
A method of manufacturing a semiconductor device including the step of forming a wiring and an inter-layer insulating film on a substrate on which a semiconductor element is formed, the method comprising the steps of:
- polishing a surface of a film to be polished after the film which provides the wiring or the inter-layer insulating film is formed;
- removing a stain on a polished surface of the film;
- detecting a state of the polished surface of the film;
- and
- returning the substrate to the removing step in conformity with the result of the detection in the detecting step.
Dependencies are inferred from the claim text.