US 2026/0200034 A1Published application

Substrate processing apparatus

AssigneeEbara Corporation

InventorsHokuto YAMANOBE, Kenichi KOBAYASHI, Akihiro YAZAWA, Sho ISHIKAWA

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Abstract

A substrate processing apparatus includes a plurality of polishing modules polishing a substrate, and a transport unit moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. The transport unit is positioned between the first module group and the second module group in a plan view. The first module group includes a first upper lane and a first lower lane in each of which at least two of the polishing modules are disposed adjacent to each other, The second module group includes a second upper lane and a second lower lane in each of which at least two of the polishing modules are disposed adjacent to each other.

Claims12

Dependent claims

A substrate processing apparatus comprising:

a plurality of polishing modules polishing a substrate;
and
a transport unit moving the substrate among the plurality of polishing modules, wherein
the plurality of polishing modules include a first module group and a second module group,
the transport unit is positioned between the first module group and the second module group in a plan view,
the first module group includes a first upper lane in which at least two of the polishing modules are disposed adjacent to each other, and a first lower lane in which at least two of the polishing modules are disposed adjacent to each other and which is disposed below the first upper lane, and
the second module group includes a second upper lane in which at least two of the polishing modules are disposed adjacent to each other, and a second lower lane in which at least two of the polishing modules are disposed adjacent to each other and which is disposed below the second upper lane.

4 more elements

A substrate processing apparatus comprising:

a transport unit including an upper transport device transporting a first substrate and a lower transport device transporting a second substrate;
an upper lane including a plurality of polishing modules which are provided to be arranged in a transport direction of the upper transport device and polish the first substrate;
and
a lower lane including a plurality of polishing modules which are provided to be arranged in a transport direction of the lower transport device and polish the second substrate, wherein
the polishing modules are attachable to and detachable from the transport unit,
the upper lane and the lower lane are disposed in parallel at different height positions,
the upper transport device performs transfer of the first substrate between itself and the upper lane, and
the lower transport device performs transfer of the second substrate between itself and the lower lane.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/135,173Filed 22 Nov 2023
Priority: JP 2022-1971229 Dec 2022
Published: 16 Jul 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

B24B 27/0069
Other grinding machines or devices: with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
H10P 72/0472
Comprising a chamber adapted to a particular process: comprising at least one polishing chamber
B24B 7/228
For grinding inorganic material, e.g. stone, ceramics, porcelain: for grinding thin, brittle parts, e.g. semiconductors, wafers
B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers