Integrated electrodeposition and chemical-mechanical polishing tool
AssigneeApplied Materials, Inc.
InventorsSasson Somekh, Debabrata Ghosh, Bret W. Adams
Life of this patent
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Abstract
A fabrication tool integrates one or more electrodeposition stations with a CMP apparatus. The tool may transport substrates from the electroplating stations to the CMP apparatus without an intervening cleaning step. In addition, the thickness of an electrodeposited layer may be measured at a metrology station prior to polishing utilizing an instrument which physically contacts the surface of the substrate, and the measured thickness may be used to adjust the polishing parameters. Furthermore, the fabrication tool may have a single interface in which a dry and clean wafer is returned to the interface.
Claims17
An integrated system for processing a substrate for fabricating a semiconductor device, comprising:
- a first electrodeposition station for electrodepositing a metal layer on the substrate;
- a chemical mechanical polishing apparatus for polishing the metal layer;
- a substrate-handling robot for transporting the substrate from the electrodeposition station to the chemical mechanical polishing apparatus;
- to
- wherein the electrodeposition station, chemical mechanical polishing apparatus and substrate-handling robot are disposed to form an integrated system.
An integrated system for processing a substrate for fabricating a semiconductor device, comprising:
- an electrodeposition station for electrodepositing a metal layer on a substrate;
- a chemical mechanical polishing apparatus for polishing the metal layer;
- a substrate-handling robot for transporting the substrate between the electrodeposition station and the chemical mechanical polishing station while the substrate is wet;
- and
- wherein the electrodeposition station, chemical mechanical polishing apparatus and substrate-handling robot are disposed to form an integrated system.
Dependencies are inferred from the claim text.