Chemical mechanical polishing device and method for processing wafer using same

A chemical mechanical polishing device, comprising:

• a polymer coater configured to apply a polymer liquid onto an insulating film formed on a surface of a wafer;
• a curer configured to form a polymer layer on the insulating film by inducing curing of the polymer liquid;
• a polisher configured to polish the surface of the wafer on which the polymer layer is formed;
• a polymer remover configured to remove a residue of the polymer layer remaining on the polished surface of the wafer;
• a cleaner configured to clean the wafer from which the residue of the polymer layer has been removed;
• and
• a wafer transferor configured to:
• transfer the wafer from the polymer coater to the curer, based on application of the polymer liquid being completed,
• transfer the wafer from the curer to the polisher, based on the polymer layer being formed by the curing of the polymer liquid,
• transfer the polished wafer from the polisher to the polymer remover, and
• transfer the wafer from the polymer remover to the cleaner, based on the residue of the polymer layer being removed.

A wafer processing method to be performed chemical mechanical polishing device, comprising:

• applying, using a polymer coater of the chemical mechanical polishing device, a polymer liquid onto an insulating film formed on a surface of a wafer;
• forming a polymer layer on the insulating film by inducing curing of the polymer liquid using a curer of the chemical mechanical polishing device;
• polishing, using a polisher of the chemical mechanical polishing device, the surface of the wafer on which the polymer layer is formed;
• and
• removing, using a polymer remover of the chemical mechanical polishing device, a residue of the polymer layer remaining on the polished surface of the wafer.