Cmp device and wafer transfer method

Abstract

Disclosed is a CMP device, comprising: a polishing module; a cleaning module; and a cleaning input module, adjacent to the polishing module and the cleaning module and comprising a wafer transfer device; wherein, the wafer transfer device at least has a first operating state and a second operating state; in the first operating state, the wafer transfer device receives a wafer transferred from the polishing module, and the wafer is in a horizontal or approximately horizontal state; and in the second operating state, the wafer transfer device directly turns the wafer from the horizontal or approximately horizontal state to a vertical state. Further disclosed is a wafer transfer method. Integrated robot arm and transfer platform, wafer transfer between polishing module and cleaning module is achieved by wafer transfer device, simplified the intermediate transfer process and structure, and improved transfer efficiency; And it has a simple structure, and high transmission efficiency.

Dependencies are inferred from the claim text.