Multiple-chamber semiconductor serial constructing apparatus

A multiple-chamber semiconductor serial constructing apparatus, comprising:

• a first vacuum-transfer module having a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are opposite to each other, the third side is adjacent to the first side and the fourth side, and the fourth side is adjacent to the second side and the third side;
• a first load-lock module comprising two first load-lock chambers, the two first load-lock chambers adjacent to each other and coupled with the first side of the first vacuum-transfer module;
• a second load-lock module comprising two second load-lock chambers, the two second load-lock chambers adjacent to each other and coupled with the second side of the first vacuum-transfer module;
• a first process-transfer module comprising:
• a second vacuum-transfer chamber coupled with the two second load-lock chambers;
• a first process-transfer chamber diagonally coupled with the second vacuum-transfer chamber and configured to be coupled with an ion implantation assembly;
• and
• a heating chamber coupled with the second vacuum-transfer chamber;
• a third load-lock module comprising:
• a third load-lock chamber coupled with the fourth side of the first vacuum-transfer module;
• and
• a third vacuum-transfer chamber coupled with the third load-lock chamber;
• a second process-transfer module comprising two second process-transfer chambers, the two second process-transfer chambers respectively coupled with two opposite sides of the third vacuum-transfer chamber;
• and
• a third process-transfer module comprising a fourth load-lock chamber, the fourth load-lock chamber coupled with the third vacuum-transfer chamber and the third side of the first vacuum-transfer module.