H10P 72/0476
Comprising at least one plating chamber
Official title: {comprising at least one plating chamber}
H10P72/0476 (Comprising at least one plating chamber) appears on 206 US grants and 302 published applications in this corpus.
Search patents in H10P- Granted patents
- 206
- Published applications
- 302
- Assignees
- 65
- Inventors
- 601
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 5 |
| 2002 | 4 | 17 |
| 2003 | 16 | 17 |
| 2004 | 10 | 23 |
| 2005 | 6 | 25 |
| 2006 | 7 | 11 |
| 2007 | 14 | 11 |
| 2008 | 7 | 20 |
| 2009 | 4 | 7 |
| 2010 | 3 | 0 |
| 2011 | 8 | 9 |
| 2012 | 5 | 11 |
| 2013 | 4 | 4 |
| 2014 | 6 | 11 |
| 2015 | 5 | 8 |
| 2016 | 11 | 11 |
| 2017 | 8 | 7 |
| 2018 | 8 | 11 |
| 2019 | 2 | 11 |
| 2020 | 17 | 17 |
| 2021 | 10 | 12 |
| 2022 | 10 | 17 |
| 2023 | 10 | 19 |
| 2024 | 5 | 6 |
| 2025 | 10 | 9 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pre-wet module14 Jul 2026US 12,685,063 B2Ebara Corporation
- Method for manufacturing semiconductor silicon wafer composed of silicon wafer substrate and silicon monocrystalline epitaxial layer5 May 2026US 12,622,185 B2Globalwafers Japan Co., Ltd.
- Corrosion-resistant components3 Mar 2026US 12,567,564 B2CoorsTek, Inc.
- Semiconductor film plating perimeter mapping and compensation3 Mar 2026US 12,568,778 B2APPLIED Materials.Inc.
- Dry etching apparatus and wafer etching system using the same28 Oct 2025US 12,456,627 B2Samsung Electronics Co., Ltd.
- Method of Plasma Processing a Workpiece23 Jul 2026US 2026/0213138 A1
- Semiconductor film plating perimeter mapping and compensation9 Jul 2026US 2026/0198236 A1APPLIED Materials.Inc.
- Photon-assisted chemical etching of silicon carbide films from reaction chamber parts12 Mar 2026US 2026/0071320 A1Lpe S.P.A.
- Processing method for silicon carbide single crystal substrate, silicon carbide single crystal substrate processing system, and replenishing liquid4 Dec 2025US 2025/0369155 A1Tokyo Ohka Kogyo.Co., Ltd.
- Water-based pretreatment for photoresist scum removal30 Oct 2025US 2025/0334884 A1Lam Research Corporation
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Apparatus for electro-chemical deposition with thermal anneal chamber441US 6,136,163 AAPPLIED Materials.Inc. · 2000
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Electroless plating liquid and semiconductor device258US 6,717,189 B2Ebara Corporation · 2004
- Integrated vacuum and plating cluster system142US 6,017,820 ACutek Research, Inc. · 2000