Water-based pretreatment for photoresist scum removal
AssigneeLam Research Corporation
InventorsKari THORKELSSON, Michael LUKASSER, Patrick Simon DOBROUNIG, Christian FISCHER, Bryan L. BUCKALEW
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Abstract
Described herein are methods, apparatus, and systems for removing photoresist scum from a substrate. The substrate may be electroplated following photoresist scum removal. In various embodiments, the method involves receiving the substrate in a process chamber, the substrate including a layer of photoresist with features patterned therein, where photoresist scum is present in the features; and exposing the substrate to a solution including water and one or more chemistries capable of removing at least a portion of the photoresist scum from the features.
Claims21
A method of processing a substrate, the method comprising:
- receiving the substrate in a process chamber, the substrate comprising a layer of photoresist with features patterned therein, wherein photoresist scum is present in the features;
- and
- exposing the substrate to a solution comprising water and one or more chemistries, the solution capable of removing at least a portion of the photoresist scum from the features.
An apparatus for processing a substrate, the apparatus comprising:
- a process chamber;
- an inlet to the process chamber configured to provide a solution to the process chamber;
- and
- a controller configured to cause:
- receiving the substrate in the process chamber, the substrate comprising a layer of photoresist with features patterned therein, wherein photoresist scum is present in the features, and
- providing the solution to the process chamber via the inlet and exposing the substrate to the solution, the solution comprising water and one or more chemistries capable of removing at least a portion of the photoresist scum from the features.
Dependencies are inferred from the claim text.