Integrated vacuum and plating cluster system

An apparatus for processing a substrate, comprising:

• a first cluster tool including a first processing chamber for processing the substrate in a low pressure first environment;
• a second cluster tool including a second processing chamber for electroplating the substrate in a second environment different than the first environment;
• and,
• a connecting interface coupled to said first and second cluster tools for transporting the substrate between said first cluster tool and said second cluster tool in a controlled environment, wherein said first cluster tool and said second cluster tool may be isolated by said connecting interface.

A method of processing a substrate, comprising the steps of:

• providing a first processing chamber for processing the substrate in a first environment;
• placing the substrate in said first processing chamber;
• processing the substrate in said first processing chamber;
• providing a connecting interface coupled to said first processing chamber;
• providing a second processing chamber for processing the substrate in a second environment different than the first environment, said second processing chamber coupled to said connecting interface;
• transferring the substrate from said first processing chamber through said connecting interface into said second processing chamber, such that said first processing chamber is environmentally isolated from said second processing chamber;
• and
• electroplating the substrate in said second processing chamber.