Dry etching apparatus and wafer etching system using the same

A wafer etching system comprising:

• an edge ring on which a wafer is mounted;
• a shadow ring positioned on an upper portion of the edge ring;
• an operation unit having a lift pin that raises and lowers the shadow ring;
• a fixing portion having a plurality of fixing pins, each of the plurality of fixing pins configured to move be ag post ion in which the fixing pin is engaged with the lift pin at a respectively different position to fix a lowering point of the shadow ring and a standby position n which the fixing pin is spaced apart from the lift pin;
• and
• a distance control unit configured to control the fixing portion to adjust the lowering point of the shadow ring and to adjust a first vertical distance by selecting any of the plurality of fixing pins,
• wherein the distance control unit determines the first vertical distance between the edge ring and the shadow ring according to a first horizontal distance between the wafer and the edge ring.

A wafer etching method comprising:

• loading a wafer into a process chamber which is arranged in the process chamber and on which the wafer is mounted;
• mounting the wafer on an edge ring;
• transferring a first horizontal distance between the wafer and the edge ring to a distance control unit;
• positioning a shadow ring to be spaced apart by a first vertical distance on an upper portion of the edge ring;
• dry etching the wafer by using plasma;
• raising the shadow ring by using an operation unit that is coupled to the shadow ring and has a lift pin that raises and lowers the shadow ring;
• and
• unloading the wafer to an outside of the process chamber,
• wherein the first vertical distance is determined by the first horizontal distance,
• wherein the raising the shadow ring comprises,
• adjusting the first vertical distance by selecting one of a plurality of fixing pins included in a fixing portion, and
• moving the one of the plurality of fixing pins from a standby position in which the one of the plurality of fixing pins is spaced apart from the lift pin to an operating position in which the one of the plurality of fixing pins is engaged with the lift pin at a position to fix a lowering point of the shadow ring.