H10P 14/6509
By exposure to electromagnetic radiation
Official title: {by exposure to electromagnetic radiation, e.g. UV light}
H10P14/6509 (By exposure to electromagnetic radiation) appears on 49 US grants and 49 published applications in this corpus.
Search patents in H10P- Granted patents
- 49
- Published applications
- 49
- Assignees
- 42
- Inventors
- 160
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 1 |
| 2006 | 3 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 2 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 3 | 1 |
| 2014 | 1 | 3 |
| 2015 | 2 | 4 |
| 2016 | 5 | 3 |
| 2017 | 3 | 2 |
| 2018 | 1 | 4 |
| 2019 | 3 | 1 |
| 2020 | 7 | 8 |
| 2021 | 1 | 2 |
| 2022 | 2 | 0 |
| 2023 | 0 | 3 |
| 2024 | 0 | 1 |
| 2025 | 2 | 1 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid chemical and method for producing liquid chemical9 Jun 2026US 12,650,647 B2FUJIFILM Corporation
- Carrier structure and methods of forming the same7 Apr 2026US 12,599,042 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Composition25 Nov 2025US 12,480,025 B2Denka Company Limited
- Manufacturing method of RF components25 Mar 2025US 12,261,059 B2STMicroelectronics (Tours) SAS
- Method for producing silicon nitride film8 Nov 2022US 11,495,452 B2Nippon Shokubai Co., Ltd.
- Liquid chemical and method for producing liquid chemical3 Sep 2026US 2026/0259503 A1FUJIFILM Corporation
- Carrier structure and methods of forming the same20 Aug 2026US 2026/0248043 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Surface inhibition to reduce bottom up oxide deposition in vertical trench21 May 2026US 2026/0144026 A1APPLIED Materials.Inc.
- Manufacturing method of rf components12 Jun 2025US 2025/0191935 A1STMicroelectronics (Tours) SAS
- Carrier structure and methods of forming the same22 Aug 2024US 2024/0282761 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for forming a thin layer on a semiconductor substrate and apparatus therefor628US 5,178,682 AMitsubishi Denki Kabushiki Kaisha · 1993
- UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition574US 6,284,050 B1Novellus Systems, Inc. · 2001
- Method for forming silicon-containing materials during a photoexcitation deposition process535US 7,651,955 B2APPLIED Materials.Inc. · 2010
- Method for forming silicon-containing materials during a photoexcitation deposition process497US 7,648,927 B2APPLIED Materials.Inc. · 2010
- Atomic layer deposition method for depositing a layer469US 7,579,285 B2Imec · 2009