UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition
AssigneeNovellus Systems, Inc.
InventorsJianou Shi, James C. Mitchener
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Abstract
An ultraviolet-assisted chemical vapor deposition system for improving the adhesion, hardness, and thermal stability of organic polymer films deposited on semiconductor wafers is provided. The system includes an ultraviolet lamp and a tube-shaped monomer distribution system positioned over the wafer allowing ultraviolet irradiation of the wafer before, during and/or after deposition. Processes for depositing organic polymer films on semiconductor wafers are also provided. The processes include one or more depositions, one or more ultraviolet exposures, and one or more anneals.
Claims23
A process for depositing a polymer film on a semiconductor wafer comprising:
- depositing a layer of a low dielectric constant polymer material on said wafer by chemical vapor deposition to form a coated wafer;
- exposing said coated wafer to ultraviolet radiation;
- and
- heating said coated wafer, wherein the polymer film is annealed.
A process for increasing the adhesion of a polymer film to a semiconductor wafer comprising:
- depositing a film of a low dielectric constant polymer material on said wafer;
- and
- subsequently exposing said wafer to ultraviolet radiation, wherein the adhesion of said film to said semiconductor wafer is increased.
A process for depositing a polymer film on a semiconductor wafer comprising exposing said wafer to ultraviolet radiation during chemical vapor deposition of said film.
A process for depositing a polymer film on a surface of a semiconductor wafer, the process comprising:
- exposing said surface to ultraviolet radiation;
- and
- depositing said polymer film on said exposed surface.
A process for depositing a polymer film on a semiconductor wafer, the process comprising:
- depositing a layer of a low dielectric constant polymer material on said wafer to form a coated wafer;
- and
- exposing said coated wafer to ultraviolet radiation while heating said coated wafer, wherein said layer of polymer material is annealed.
A process for depositing a polymer film on a semiconductor wafer comprising:
- depositing a first layer of a low dielectric constant polymer material on said wafer by chemical vapor deposition;
- exposing said first layer to ultraviolet radiation;
- depositing a second layer of said low dielectric constant polymer material on said first layer to form said polymer film;
- and
- heating said polymer film, wherein said polymer film is annealed.
Dependencies are inferred from the claim text.