H10P 14/6342
Liquid deposition
Official title: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
H10P14/6342 (Liquid deposition) appears on 2,863 US grants and 2,698 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,863
- Published applications
- 2,698
- Assignees
- 723
- Inventors
- 5,533
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 0 | 0 |
| 1982 | 6 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 11 | 0 |
| 1986 | 15 | 0 |
| 1987 | 11 | 0 |
| 1988 | 17 | 0 |
| 1989 | 15 | 0 |
| 1990 | 17 | 0 |
| 1991 | 21 | 0 |
| 1992 | 23 | 0 |
| 1993 | 20 | 0 |
| 1994 | 24 | 0 |
| 1995 | 38 | 0 |
| 1996 | 33 | 0 |
| 1997 | 43 | 0 |
| 1998 | 78 | 0 |
| 1999 | 87 | 0 |
| 2000 | 100 | 0 |
| 2001 | 133 | 52 |
| 2002 | 136 | 164 |
| 2003 | 144 | 170 |
| 2004 | 128 | 191 |
| 2005 | 97 | 175 |
| 2006 | 123 | 185 |
| 2007 | 106 | 124 |
| 2008 | 78 | 106 |
| 2009 | 78 | 101 |
| 2010 | 72 | 93 |
| 2011 | 87 | 81 |
| 2012 | 62 | 68 |
| 2013 | 75 | 62 |
| 2014 | 63 | 93 |
| 2015 | 83 | 107 |
| 2016 | 78 | 102 |
| 2017 | 96 | 104 |
| 2018 | 95 | 95 |
| 2019 | 87 | 114 |
| 2020 | 110 | 113 |
| 2021 | 79 | 90 |
| 2022 | 71 | 80 |
| 2023 | 56 | 81 |
| 2024 | 60 | 62 |
| 2025 | 52 | 55 |
| 2026 | 22 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- RF devices with nanotube particles for enhanced performance and methods of forming the same15 Sep 2026US 12,740,412 B2Qorvo US, Inc.
- Alkaline developer soluable silicon-containing resist underlayer film-forming composition25 Aug 2026US 12,717,235 B2Nissan Chemical Corporation
- Thin film transistor and method of manufactruting thin film transistor18 Aug 2026US 12,713,660 B2Toppan Inc.
- Inorganic/hybrid stress films18 Aug 2026US 12,713,848 B2Tokyo Electron Limited
- Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
- Polymer and composition comprising the same1 Oct 2026US 2026/0297377 A1Merck Patent GmbH
- Method of making semiconductor device having a redistribution line17 Sep 2026US 2026/0282994 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Precursor for forming low dielectric constant silicon-containing thin film and method for forming low dielectric constant silicon-containing thin film using same10 Sep 2026US 2026/0271637 A1SK hynix Inc.
- Film forming method and article manufacturing method10 Sep 2026US 2026/0271683 A1Canon Kabushiki Kaisha
- Power Semiconductor Apparatus and Bonding Method Thereof27 Aug 2026US 2026/0255938 A1Diodes Incorporated
Most cited
By later US patents
- Method for integrated circuit patterning805US 9,184,054 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for manufacturing porous structure and method for forming pattern645US 6,565,763 B1Kabushiki Kaisha Toshiba · 2003
- Methods and apparatus for material deposition577US 5,119,760 ASymetrix Corporation · 1992
- High modulus, low dielectric constant coatings575US 6,576,300 B1Axcelis Technologies, Inc. · 2003
- Plasma curing of MSQ-based porous low-k film materials567US 6,759,098 B2Axcelis Technologies, Inc. · 2004