H10P 14/6346
Using printing
Official title: {using printing, e.g. ink-jet printing}
H10P14/6346 (Using printing) appears on 113 US grants and 139 published applications in this corpus.
Search patents in H10P- Granted patents
- 113
- Published applications
- 139
- Assignees
- 77
- Inventors
- 366
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 1 | 3 |
| 2008 | 1 | 1 |
| 2009 | 2 | 1 |
| 2010 | 1 | 2 |
| 2011 | 1 | 5 |
| 2012 | 2 | 5 |
| 2013 | 1 | 0 |
| 2014 | 4 | 6 |
| 2015 | 8 | 8 |
| 2016 | 11 | 12 |
| 2017 | 10 | 12 |
| 2018 | 1 | 6 |
| 2019 | 11 | 20 |
| 2020 | 13 | 17 |
| 2021 | 11 | 9 |
| 2022 | 10 | 6 |
| 2023 | 6 | 5 |
| 2024 | 7 | 9 |
| 2025 | 8 | 4 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semicondctor device package thermal conduit16 Dec 2025US 12,500,082 B2Texas Instruments Incorporated
- Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone16 Sep 2025US 12,417,958 B2Intel Corporation
- Method of manufacturing semiconductor device including passivation layer22 Jul 2025US 12,368,090 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone1 Jul 2025US 12,347,743 B2Intel Corporation
- Fabrication of thin-film encapsulation layer for light-emitting device17 Jun 2025US 12,334,402 B2Kateeva, Inc.
- Film forming method and article manufacturing method10 Sep 2026US 2026/0271683 A1Canon Kabushiki Kaisha
- Method for manufacturing semiconductor device and mesa diode13 Aug 2026US 2026/0239638 A1Shindengen Electric Manufacturing Co., Ltd.
- Semiconductor device package thermal conduit16 Apr 2026US 2026/0107709 A1Texas Instruments Incorporated
- Selective Directed Assembly-Based Printing of Metal Oxide Dielectric Thin Films12 Mar 2026US 2026/0076112 A1Northeastern University
- Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone23 Oct 2025US 2025/0329604 A1Intel Corporation
Most cited
By later US patents
- Precursor compositions and methods for the deposition of passive electrical components on a substrate47US 7,524,528 B2Cabot Corporation · 2009
- Ink-based layer fabrication using halftoning to control thickness41US 8,995,022 B1Kateeva, Inc. · 2015
- Wafer substrate removal24US 9,419,075 B1Texas Instruments Incorporated · 2016
- Programmable deposition of thin films of a user-defined profile with nanometer scale accuracy22US 9,718,096 B2Board of Regents, The University of Texas System · 2017
- Process for formation of metal oxide film21US 4,960,618 ATokyo Ohka Kogyo.Co., Ltd. · 1990