Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone

An electronic system, comprising:

• a lower package comprising a first package substrate, a first die coupled to the first package substrate by first interconnects, and capillary underfill around the first interconnects and along sidewalls of the first die, a first mold material over the first package substrate and surrounding the capillary underfill with a curved interface between the first mold material and the capillary underfill, second interconnects through the first mold material and laterally adjacent to the first die, the second interconnects coupled to the top surface of the first package substrate;
• an upper package coupled to the lower package, the upper package comprising a second package substrate, a second die above and coupled to the second package substrate by a first wire bond, and a third die above the second die, the third die coupled to the top side of the second package substrate by a second wire bond, a second mold material over the second die and the third die and over the second package substrate, and a layer having openings therein on the bottom side of the second package substrate;
• an adhesive layer between the lower package and the upper package, the adhesive layer in contact with the layer having openings therein of the upper package, and the adhesive layer having a bottommost surface above an uppermost surface of the first mold material of the lower package;
• and
• third interconnects on the bottom side of the first package substrate of the lower package, the third interconnects beneath the first die and the second interconnects.

An electronic system, comprising:

• a first package substrate having a top side and an opposite bottom side;
• a first die coupled to the top side of the first package substrate by first interconnects;
• underfill material around the first interconnects and along sidewalls of the first die;
• a first mold layer over the first package substrate and surrounding the underfill material and the first die;
• through mold interconnects through the first mold layer and laterally adjacent to the first die, the through mold interconnects coupled to the top surface of the first package substrate;
• a second package substrate above the first die, and the first mold layer, the second package having a top side and an opposite bottom side;
• a second die above and coupled to the top side of the second package substrate by a first wire bond;
• a third die above the second die, the third die coupled to the top side of the second package substrate by a second wire bond;
• a second mold layer over the second die and the third die and over the second package substrate;
• a solder resist on the bottom side of the second package substrate;
• an adhesive layer between the second package substrate and the first mold layer, the adhesive layer in contact with the solder resist, and the adhesive layer having a bottommost surface above an uppermost surface of the first mold layer;
• and
• second interconnects on the bottom side of the first package substrate, the second interconnects beneath the first die and the through mold interconnects.